TECBOND 14-12-300 Fast Set Packaging Grade 1/2" x 12" Hot Melt Glue Sticks
TECBOND 14 is a high output packaging adhesive, suitable for use on most paper and board substrates. The low viscosity of this product helps prevent stringing, improves glue gun output and ensures bonds are made with the minimum gap between surfaces.
TECBOND 14 is a versatile packaging adhesive, the low viscosity enables it to be used for small delicate assemblies as well as very high output applications that require fast adhesive dispensing.
Short open time and low viscosity for quicker, easier dispensing without stringing
Quick grab and fast set for efficient carton sealing
Excellent bonding on most board qualities
Service temperature range from -15 deg C to 85 deg C
Color is light brown
Suggested application temperature: 380 deg F
Brookfield viscosity (POW-12-VISC) spindle 27: 2000cps @ 350degF
Ring & ball softening point (ASTM E28): 235degF
Heat resistance (BS5350 Part H3): 185degF
Open time: Short
Low temperature flexibility (tg): 14degF
Approximately 165 glue sticks per case 11 lbs. per case; price is per case
