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TECBOND 14-12-300 Fast Set Packaging Grade 1/2" x 12" Hot Melt Glue Sticks
TECBOND 14 is a high output packaging adhesive, suitable for use on most paper and board substrates. The low viscosity of this product helps prevent stringing, improves glue gun output and ensures bonds are made with the minimum gap between surfaces. TECBOND 14 is a versatile packaging adhesive, the low viscosity enables it to be used for small delicate assemblies as well as very high output applications that require fast adhesive dispensing.
Short open time and low viscosity for quicker, easier dispensing without stringing
Quick grab and fast set for efficient carton sealing
Excellent bonding on most board qualities
Service temperature range from -15 deg C to 85 deg C
Color is light brown
Suggested application temperature: 380 deg F
 Brookfield viscosity (POW-12-VISC) spindle 27: 2000cps @ 350degF 
 Ring & ball softening point (ASTM E28): 235degF 
 Heat resistance (BS5350 Part H3): 185degF 
 Open time: Short 
 Low temperature flexibility (tg): 14degF 
Approximately 165 glue sticks per case
11 lbs. per case; price is per case
Recommended alternative to 3M 3762, 3740, Ad Tech 610, or Westix ST61 and ST170

TECBOND 14-12-300 Fast Set, Packaging Grade 1/2 x 12 Hot Melt Glue Sticks

SKU: 14-12-300-ARA-BX05-TEC
Excluding Sales Tax
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