TECBOND 1X-43-043 Wood/Packaging Grade 43mm x 43mm Hot Melt Slugs
TECBOND 1X is a low viscosity, medium setting adhesive for use on paper, board, wood and many other materials. The low viscosity enables very close bonds to be made and provides excellent glue gun output.
Medium open time, effective on paper, board and wood
Low viscosity gives closer bonds and easy extrusion from tools
Service temperature range from -20C to 75C
Color is amber
Suggested application temperature is 350-380 degrees F